EBRAINS, Inc. specializes in the design, development, and manufacturing of critical components for industrial computers, including backplanes, high-speed interface boards, and electronic equipment enclosures. Leveraging its long-established strengths in high-speed signal transmission, PCB design, and thermal management technologies, the company supplies products to sectors demanding high reliability, such as telecommunications, industrial equipment, semiconductor manufacturing equipment, and defense and aerospace.

In recent years, the advancement of AI technology has driven expanding demand for high-performance computing systems equipped with AI chips, such as GPUs and NPUs. EBRAIN high-speed PCI Express transmission technology, backplane design capabilities, and power/thermal management designs hold strong potential to contribute to higher performance and reliability in AI processing infrastructures. Moving forward, through technological expansion into industrial AI systems and edge AI applications combining CPUs, GPUs, NPUs, and FPGAs, the company is expected to create value in new markets—including automated visual inspection in manufacturing, predictive equipment maintenance, and real-time analytics for the transportation and defense sectors.